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Materials International
Open Access Journal (ISSN: 2668-5728)
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  • Home
  • All issues
    • Volume 1
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    • Volume 2
      • Issue 1
      • Issue 2
      • Issue 3
      • Issue 4
  • Guidelines
    • For authors
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    • For reviewers
    • Special Issues
  • Journal info
    • Abstracting & indexing
    • Aim & scope
    • Editorial board
    • Open access info
    • Principles of Transparency
  • Submit your paper
  • Thematic issues
    • Special issue “3D and 4D Hybrid Printed Functional Prototypes”
    • Special issue “Advanced cathode materials for lithium-ion batteries”
    • Special Issue “Advanced energy storage, conversion and application materials”
    • Special issue “Advanced manufacturing and advanced materials”
    • Special issue “Advances in additive manufacturing: modeling, design, and application”
    • Special issue “Antimicrobial nanobiomaterials”
    • Special Issue “Caloric effects and related materials”
    • Special Issue “Concentrated Solar Power in industrial technologies, metallurgy and materials science”
    • Special Issue “Current trends in biopolymer-based materials”
    • Special Issue “End-of-Life (EOL) Materials recovery and Life cycle assessment (LCA)”
    • Special Issue “Functional materials for energy applications”
    • Special issue “Layered Nanohybrids as Promising Drug Delivery Vehicles”
    • Special Issue “Materials for Agricultural”
    • Special Issue “Performance-based Service Life Design of reinforced recycled aggregate concrete”
    • Special issue “Perovskite photovoltaics and optoelectronic devices”
    • Special Issue “Recent developments of molecularly imprinted materials”
    • Special issue “Reinforced Composite Materials Including Natural Fiber for Industrial and Household Applications”
    • Special issue “Science and Technology of Sustainable Materials for Industrial Applications”
    • Special Issue “Synthesis, characterization and functional devices application of novel two-dimensional materials”
    • Special Issue “Thin-film materials, devices and carrier dynamics for flexible electronics”
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